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Polycarbonate inlays protect against ID card de-lamination

KSW Microtec : 08 May, 2008  (New Product)
RFID inlays from KSW Microtec enable ease of lamination into smart cards for use in ID cards and driving licenses offering long life cycles.
KSW Microtec will be launching its new UHF polycarbonate inlay for security-critical applications in the government and enterprise ID sectors at CTST 2008 in Orlando, Florida, from May 12 to 15.

KSW Microtec's UHF inlay polycarbonate tag is an example of the company's commitment to innovation and is ideally suited for the production of border crossing cards, drivers' licenses, police ID and national ID cards. Unlike a traditional PET inlay, this new product, with orders already on hand, is easily laminated into a polycarbonate card, ensuring a matching material connection and thus safeguarding against card delamination.

As with other KSW inlays, the UHF polycarbonate tag can be produced in roll or sheet format, including customised sheet layouts. KSW incorporates antennae printing and chip assembly, bringing significant cost-saving benefits to customers.

In addition, KSW Microtec, which recently received the Texas Instruments (TI) Supplier Excellence Award (SEA) for contributing significantly to TI business success through outstanding performance and continuous improvement as a TI supplier, will highlight its latest contactless credit card inlays
produced in sheet format for card issuers in the financial sector. The award has particular relevance to this sector and in particular to KSW's credit card inlay for the transparent American Express card.

In the financial sector, KSW's contactless credit card inlays in sheet format provide the same outstanding quality and performance as the company's inlays for reel-to-sheet manufacturing, already proven by more than 20 million contactless credit cards in the US market alone.

Using a special PET substrate, the new sheet inlays can be directly laminated into PVC layers for fast, reliable and cost-effective card production. The ICs on the RFID inlays are attached using KSW's palladium bump technology, which generates an extremely reliable connection between
chip and the aluminium antenna for a long inlay life span.

Both new product ranges have been developed to suit the crucial security needs of ID and finance applications. The manufacturing processes are substrate specific, but the production efficiencies and benefits are identical.

Visit KSW Microtec at CTST 2008, in the Orange County Convention Centre on booth: 923
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