CPI Card Group has announced new initiatives with NXP Semiconductors and KSW Microtec to broaden its portfolio of contactless offerings and provide customers with expanded contactless technology solutions from two widely respected developers.
Demand for contactless cards in the financial payment card market has increased significantly over the past several years. Given this new partnership and years of global experience, CPI now offers additional qualified alternatives in the supply chain development of contactless payment cards to meet the growing marketplace demands.
"In order to provide the best products for our customers, we feel it¹s important to offer a variety of technology choices and solutions from reliable partners in the industry," says Benoit Guez, director of Smart Cards and New Technologies at CPI. "Both NXP and KSW have demonstrated their commitment to developing cutting-edge technologies in the contactless space, and we look forward to working together as a team to meet our clients' needs, and exceed their expectations."
NXP Semiconductors offers a broad portfolio of solutions for banking applications, providing customers with a combination of proven security and performance with their ICs. NXP¹s Fast Pay contactless security chip, deployed with CPI, can be widely used for contactless payment applications and is specifically designed to provide consumers in the USA and Canada with a secure, fast and comfortable payment experience. Its embedded Data Encryption Standard (DES) hardware co-processor and best-in-class contactless performance provides strong security and fast transaction times.
KSW Microtec is a supplier of contactless prelaminates for ePayment, eGovernment and Access Control applications. The KSW Thinlam, a contactless prelaminate for card manufacturers, provides exceptional thinness and maintains the highest reliability and durability thanks to its unique assembly technology. Thinlam is the ideal solution for any contactless
personal identification application especially where security, performance and appearance are important.
"We are extremely pleased that CPI has selected NXP as a key technology partner for the US banking market," says Karsten Danziger, director of Banking Identification at NXP Semiconductors. "Our Fast Pay solution will enable swift and secure payment transactions. Working together with CPI and KSW we will create differentiating solutions that enable the best
possible customer contactless payment experience. NXP continues to raise the bar with respect to the security, reliability, performance, and size of our contactless solutions."
"We are delighted about the business partnership with our valued customer CPI. By combining both our smart and innovative technologies, CPI and KSW establish new possibilities in card manufacturing," says Thomas Hitzer, CEO of KSW Microtec. "In cooperation with our partners, we are committed to provide innovative, durable and secure RFID components, such as PVC Thinlam with NXP¹s Fast Pay chip, for secure contactless card applications worldwide."